IEC 63251:2023 pdf download - Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

IEC 63251:2023 pdf download – Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

IEC 63251:2023 establishes the procedures for conducting thermal endurance tests to evaluate the reliability of flexible opto-electric circuit boards. The aim of this standard is to guarantee that flexible opto-electric circuits, including those used in vehicles, exhibit consistent thermal properties. It particularly describes a testing procedure that is intended to detect instances of color change, warping, and peeling of the flexible opto-electric circuit boards when subjected to thermal strain.

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